Bag, Statshield Foil Mbb, Ipc/ Jedec 4 Mil, 16inx18in, 100/Pk
- NEW IPC/JEDEC J-STD-033B Moisture Sensitive Caution Label Printed on Foil Moisture Barrier Bag1 Identifies moisture sensitive devices for levels 2, 2a, 3, 4, 5, and 5a as defined by J-STD-020. Does not require additional labeling.
- Film Laminate Metal Layered 0.0040” (4 mil) Thick Moisture Barrier Bag Designed for electrostatic discharge (ESD) shielding protection when dry packing components. Meets ANSI/ESD S20.20, ANSI/ESD SS41, and ANSI/ESD S11.4 Level 1.
- MVTR <0.0003 Grams per ASTM F1249-902 (Flex Testing per ASTM F3923) Designed for dry packing of moisture sensitive devices and to protect contents from damage due to ESD events or EMI.
- Insulative Nylon Reinforcement Layer Strengthens bag structure to maintain performance per ASTM F392 flex testing and meets the ANSI/ESD S541 requirement as a barrier to current flow.
- <10 nJ Energy Penetration Tested per ANSI/ESD STM11.31 Protects contents from ESD charges and discharges.
- >25lb Puncture Strength Average per FTMS 101C/4046 Provides physical protection for contents.
- Dissipative Inner and Outer Surfaces Rs 1 x 104 to <1011 ohms per ANSI/ESD STM11.11 Allows bag to be grounded when placed on a grounded surface
- Printed with ESD Protective Symbol and lot code information Meets the requirements of ANSI/ESD S541 for quality control purposes.
- Lead-free RoHS 2 and REACH compliant
- Made in the United States of America This item is made and stocked in
- from internationally sourced laminate film
1Dry packaging for electronics requires three elements:
Statshield® Moisture Barrier Bags - To Protect
Desiccant - To Absorb Moisture
Humidity Indicator Card - To Monitor Performance
For detailed instructions see Technical Bulletin TB-2031 - Moisture Barrier Bags Application Instructions.
2ASTM F1249-90 test method covers a procedure for determining the rate of water vapor transmission through flexible barrier materials.
3ASTM F392 (condition E) test method determines the resistance of flexible-packaging materials to flex-formed pinhole failures.
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